Pin headers and mother headers are no strangers to practitioners in the component industry. Explain their types and processing techniques.

1. Applications: smart meters, meters, PCB circuit boards, UPS, inverters, driving recorders, car anti-theft alarms, network switches, routers, notebooks, computers, MIDs, digital cameras, boards, smart communication products, smart home appliances, etc.

2. Function: Its function is to act as a bridge between closed circuits or isolated circuits, and undertake the task of current or signal transmission. It is usually used with busbars to form a board-to-board connection; or with the electronic wiring harness end to form a board-to-wire connection; it can also be used independently for board-to-board connection.

3. Classification and type:

① According to the spacing distance, the pin header and the mother header are mainly divided into 0.8mm, 1.0mm, 1.27mm, 2.0mm, and 2.54mm spacing.

② According to the height and number of plastics (such as single plastic, double plastic, triple plastic, etc.).

③ The number of rows of pin headers and mother headers can be divided into single row, double row, triple row, quadruple row, etc.

④ The installation method is represented by S for 180 degrees, R for 90 degrees, and m for SMT.

4. Packaging methods include bags, tubes, and rolls.

5. Material: The pin material is brass or phosphor bronze; the insulation material is plastic UL 94V-0.

6. Surface treatment: 0.8u gold plating, tin plating, nickel plating.

7. Processing technology: The production process of pin and mother headers should be made of brass (or phosphor bronze) according to the needs, and then nickel-plated and gold-plated as required, and then the insulator parts should be processed with molds, and finally the pins should be embedded in the insulator according to the size requirements on special equipment.

The above are the types and processing technologies of pin and mother headers. They are basic components. Different fields require different electrical performance to meet application scenarios and harsh environments.